【EXCELLENT THERMAL CONDUCTIVITY】:
Upgraded thermal silica gel material with 22.5±0.1 W/mK thermal conductivity, Density (G/cc): 2.6 g/cc ,our thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.

【EASY & CONVENIENT TO USE】:
Dimension 30x50x0.25mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.